The High-Performance Materials Institute (HPMI) at FSU has a complete set of state-of-the-art processing, testing, characterization and computing facilities for materials, composites and nanocomposite research. Most equipment, valued at approximately $8,000,000 is housed in the 45,000 square foot Materials Research Building. HPMI has the resources multiple capabilities including:
Advanced Manufacturing
nScrypt 3D-450n/MTGeng
Laser annealing nScrypt 3D-300n with pick-n-place/conformal mapping
Optomec Aerosol jet printer
Stratasys Objet and Dimension systems
DeXter printer and in-house autonomous-AM robotic system (AR3iS)
KLA iNano Nanoindenter with hardness and modulus property mapping
Lulzbots (6)
In-house custom 3D printers
Complete Equipment Listing
Resources
Environmental Property Testing
Imaging and Microscopy
Materials, Composites and Nanocomposite Processing
Materials Synthesis
Mechanical Property Testing
Modeling and Simulation
Spectroscopy
Thermal Analysis
Complete Equipment Listing
Materials Synthesis
- Chemical Vapor Deposition System, EasyTube 3000 (MRB 224)
- E-Beam evaporator, 6" Torvac and 6" Veeco dual system
- MTI GSL-1600X, High temperature vacuum tube furnace (1500°C, Φ50 mm×1000 mm) (MRB 127) Photo
- Specialty Coating Systems G3P-8 spin coater with hot-stage (MRB 232)
- Sheet drawing apparatus
- Cole-Palmer vacuum ovens (~350°C) (MRB 124)
- Ductless fume hood (Aura, particles larger than 0.3 microns), Misonix (COE B216)
- UV curing machine, 15"×15", FS600, Fusion UV (MRB 127)
Materials, Composites and Nanocomposite Processing
- GERBER conveyorized fiber cutter (GTxL Multi-Ply Cutter) (MRB 127) Photo
- Waterjet cutter, OMAX 55100/30 (MRB 137) Photo
- Computer numerical control (CNC) machine, HAAS, VF2
- Autoclave, ASC, Econoclave EC3X6 (MRB 127)
- Additive manufacturing 3-D printer, Objet 30 (MRB 128)
- Integrated continuous buckypaper fabrication station
- Hot presses (6"x6", 12"x12" and 24"x24") (MRB 127)
- Ovens (various)
- RIDFT machines (various sizes) (MRB 127)
- RTM Machine, Liquid Control-Twinflow
- VARTM process setups
Imaging and Microscopy
- Leica Microsystems, EM FC6 Ultramicrotome (MRB 126) Video
- Atomic force microscope (AFM), Veeco Instruments Inc., Multimode with nanoscope V (MRB 126) Photo Video
- High resolution Field Emission Scanning Electron Microscope (FESEM), JEOL 7401F (COE B115-116)
- Olympus BX40 with CCD camera (5X, 10X, & 50X lens) (MRB 140)
- CytoVivaTM Microscopy (MRB 248)
- Microimaging SV-11 Apo, CCD camera, stereo/optical combination microscope, Carl Zeiss (MRB 248)
- High resolution sputter coater, Polaron, SC 7640
- High-resolution TEM system, JEOL (shared) (COE B115-116)
- 3D Digitizer/Scanner, Minolta Vivid 910 (MRB 127)
Spectrocopy
- Renishaw Confocal Research Raman Microscopy (upgraded InVia, 633 nm and 785 nm laser sources) (MRB 126) Photo
- SAXS/WAXS X-ray scattering, Bruker, Nanostar (MRB 126) Video
- UV-Vis-NIR Spectrophotometer, Varian Cary 5000 (MRB 224)
- FT-IR with microscopy (4000-200 cm-1) Thermo Nicolet NEXUS 470 (COE B216) Photo
- Zeta Potential & Particle Size Analyzer, Beckman Coulter, Delsa Nano C (MRB 224)
- Ultracentrifuge, Beckman Coulter, Optia Max XP (MRB 224)
- Surface Area and Porosity Analyzer, Micrometrics Inc., Tristar (MRB 224)
Thermal Analysis
- Differential Scanning Calorimeter , DSC Q100, TA Instrument (MRB 224)
- Thermomechanical Analyzer, TMA2940, TA Instrument (MRB 224)
- Thermogravimetric Analyzer, TGA Q50, TA Instrument (MRB 224) Photo
- Dynamic Mechanical Analyzer, DMA2980, TA Instrument (MRB 224)
- Dynamic Mechanical Analyzer, Q800, TA Instrument (MRB 224)
- Rheometer, ARES-LS2, TA Instrument
- Laser flash thermal conductivity measurement system, Netzsch LFA 457 Microflash (COE B115-116)
- Integrated IR Camera-Analyzer, IR Instruments (MRB 232)
Electrical Conductivity Measurements
- Four-probe, two-probe, and surface electrical resistivity measurement setups (four Keithley 2002 MEM multimeters and HP power supplies) (MRB 248)
- Janis Research VPF-100 cryostat system
Mechanical Property Testing
- MTS 585 test machine (25KN, hydraulic grips, laser strain gauge)
- MTS 858, table top system (COE B216)
- Micro test frame, Shimadzu AGS-J (500 N and 1 kN load cells) (MRB 127)
- Video extensometer system, Shimadzu (DVE-201 video extensometer system and TH229 pneumatic grips, Accuracy: +/- 0.01 mm) (MRB 140)
Environmental Property Testing
Modeling and Simulation
- Thermal analysis software (ABAQUS, ANSYS, MARC)
- Molecular dynamics modeling of interfacial bonding and load transfer (Materials Studio (SGI Origin 300), LAMMPS (Teragold IBM p-Series 690))
- Modeling of conductive network-electrical property relationships for polymer/carbon nanotube composites
- Simulation software for composite materials processing (RTMSim, etc.)