LASER PROCESSING SYSTEM

Model
M-300
d

Cut through substrates such as heat-resistant glass, some plastics/polymers, nylon, papers, some rubber, silicone, etc. Works with a CO2 laser that emits in the infrared spectrum to cut or etch patterns by vaporizing the substrate. Applications may involve precision-cut rubilith masks, micromachining plexiglass, microfluidic channels in polymers, direct cutting or etching of PDMS. Resulting in plexiglass containers, ports, or microfluidics, among others. 

Specifications