Equipment

The High-Performance Materials Institute (HPMI) at FSU has a complete set of state-of-the-art processing, testing, characterization and computing facilities for materials, composites and nanocomposite research. Most equipment, valued at approximately $22,000,000 is housed in the 45,000 square foot Materials Research Building. HPMI has the resources multiple capabilities including:

Advanced Manufacturing

nScrypt 3D-450n/MTGeng
Laser annealing nScrypt 3D-300n with pick-n-place/conformal mapping
Optomec Aerosol jet printer
Stratasys Objet and Dimension systems
DeXter printer and in-house autonomous-AM robotic system (AR3iS)
KLA iNano Nanoindenter with hardness and modulus property mapping
Lulzbots (6)
In-house custom 3D printers
Complete Equipment Listing

 

 


Materials Synthesis
  • Chemical Vapor Deposition System, EasyTube 3000 (MRB 224)
  • E-Beam evaporator, 6" Torvac and 6" Veeco dual system
  • MTI GSL-1600X, High temperature vacuum tube furnace (1500°C, Φ50 mm×1000 mm) (MRB 127) Photo
  • Specialty Coating Systems G3P-8 spin coater with hot-stage (MRB 232)
  • Sheet drawing apparatus
  • Cole-Palmer vacuum ovens (~350°C) (MRB 124)
  • Ductless fume hood (Aura, particles larger than 0.3 microns), Misonix (COE B216)
  • UV curing machine, 15"×15", FS600, Fusion UV (MRB 127)


Materials, Composites and Nanocomposite Processing
  • Waterjet cutter, OMAX 55100/30 (MRB 137) Photo
  • Computer numerical control (CNC) machine, HAAS, VF2
  • Autoclave, ASC, Econoclave EC3X6 (MRB 127)
  • Additive manufacturing 3-D printer, Objet 30 (MRB 128)
  • Hot presses (6"x6", 12"x12" and 24"x24") (MRB 127)
  • Ovens (various)
  • RIDFT machines (various sizes) (MRB 127)
  • RTM Machine, Liquid Control-Twinflow
  • VARTM process setups


Imaging and Microscopy
  • Leica Microsystems, EM FC6 Ultramicrotome (MRB 126) Video
  • Atomic force microscope (AFM), Veeco Instruments Inc., Multimode with nanoscope V (MRB 126) Photo Video
  • High resolution Field Emission Scanning Electron Microscope (FESEM), JEOL 7401F (COE B115-116)
  • Olympus BX40 with CCD camera (5X, 10X, & 50X lens)(MRB 140)
  • CytoVivaTM Microscopy (MRB 248)
  • Microimaging SV-11 Apo, CCD camera, stereo/optical combination microscope, Carl Zeiss (MRB 248)
  • High resolution sputter coater, Polaron, SC 7640
  • High-resolution TEM system, JEOL (shared)(COE B115-116)
  • 3D Digitizer/Scanner, Minolta Vivid 910 (MRB 127)


Spectrocopy


Thermal Analysis
  • Differential Scanning Calorimeter , DSC Q100, TA Instrument (MRB 224)
  • Thermomechanical Analyzer, TMA2940, TA Instrument (MRB 224)
  • Thermogravimetric Analyzer, TGA Q50, TA Instrument (MRB 224) Photo
  • Dynamic Mechanical Analyzer, DMA2980, TA Instrument (MRB 224)
  • Dynamic Mechanical Analyzer, Q800, TA Instrument (MRB 224)
  • Rheometer, ARES-LS2, TA Instrument
  • Laser flash thermal conductivity measurement system, Netzsch LFA 457 Microflash (COE B115-116)
  • Integrated IR Camera-Analyzer, IR Instruments (MRB 232)


Electrical Conductivity Measurements
  • Four-probe, two-probe, and surface electrical resistivity measurement setups (four Keithley 2002 MEM multimeters and HP power supplies) (MRB 248)
  • Janis Research VPF-100 cryostat system


Mechanical Property Testing


Environmental Property Testing


Modeling and Simulation
  • Thermal analysis software (ABAQUS, ANSYS, MARC)
  • Molecular dynamics modeling of interfacial bonding and load transfer (Materials Studio (SGI Origin 300), LAMMPS (Teragold IBM p-Series 690))
  • Modeling of conductive network-electrical property relationships for polymer/carbon nanotube composites
  • Simulation software for composite materials processing (RTMSim, etc.)

 

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