The High-Performance Materials Institute (HPMI) at FSU has a complete set of state-of-the-art processing, testing, characterization and computing facilities for materials, composites and nanocomposite research. Most equipment, valued at approximately $22,000,000 is housed in the 45,000 square foot Materials Research Building. HPMI has the resources multiple capabilities including:
Advanced Manufacturing
nScrypt 3D-450n/MTGeng
Laser annealing nScrypt 3D-300n with pick-n-place/conformal mapping
Optomec Aerosol jet printer
Stratasys Objet and Dimension systems
DeXter printer and in-house autonomous-AM robotic system (AR3iS)
KLA iNano Nanoindenter with hardness and modulus property mapping
Lulzbots (6)
In-house custom 3D printers
Complete Equipment Listing
Materials Synthesis
- Chemical Vapor Deposition System, EasyTube 3000 (MRB 224)
- E-Beam evaporator, 6" Torvac and 6" Veeco dual system
- MTI GSL-1600X, High temperature vacuum tube furnace (1500°C, Φ50 mm×1000 mm) (MRB 127) Photo
- Specialty Coating Systems G3P-8 spin coater with hot-stage (MRB 232)
- Sheet drawing apparatus
- Cole-Palmer vacuum ovens (~350°C) (MRB 124)
- Ductless fume hood (Aura, particles larger than 0.3 microns), Misonix (COE B216)
- UV curing machine, 15"×15", FS600, Fusion UV (MRB 127)
Materials, Composites and Nanocomposite Processing
- Waterjet cutter, OMAX 55100/30 (MRB 137) Photo
- Computer numerical control (CNC) machine, HAAS, VF2
- Autoclave, ASC, Econoclave EC3X6 (MRB 127)
- Additive manufacturing 3-D printer, Objet 30 (MRB 128)
- Hot presses (6"x6", 12"x12" and 24"x24") (MRB 127)
- Ovens (various)
- RIDFT machines (various sizes) (MRB 127)
- RTM Machine, Liquid Control-Twinflow
- VARTM process setups
Imaging and Microscopy
- Leica Microsystems, EM FC6 Ultramicrotome (MRB 126) Video
- Atomic force microscope (AFM), Veeco Instruments Inc., Multimode with nanoscope V (MRB 126) Photo Video
- High resolution Field Emission Scanning Electron Microscope (FESEM), JEOL 7401F (COE B115-116)
- Olympus BX40 with CCD camera (5X, 10X, & 50X lens)(MRB 140)
- CytoVivaTM Microscopy (MRB 248)
- Microimaging SV-11 Apo, CCD camera, stereo/optical combination microscope, Carl Zeiss (MRB 248)
- High resolution sputter coater, Polaron, SC 7640
- High-resolution TEM system, JEOL (shared)(COE B115-116)
- 3D Digitizer/Scanner, Minolta Vivid 910 (MRB 127)
Spectrocopy
- Renishaw Confocal Research Raman Microscopy (upgraded InVia, 633 nm and 785 nm laser sources) (MRB 126) Photo
- SAXS/WAXS X-ray scattering, Bruker, Nanostar (MRB 126) Video
- UV-Vis-NIR Spectrophotometer, Varian Cary 5000 (MRB 224)
- FT-IR with microscopy (4000-200 cm-1) Thermo Nicolet NEXUS 470 (COE B216)Photo
- Zeta Potential & Particle Size Analyzer, Beckman Coulter, Delsa Nano C (MRB 224)
- Ultracentrifuge, Beckman Coulter, Optia Max XP (MRB 224)
Thermal Analysis
- Differential Scanning Calorimeter , DSC Q100, TA Instrument (MRB 224)
- Thermomechanical Analyzer, TMA2940, TA Instrument (MRB 224)
- Thermogravimetric Analyzer, TGA Q50, TA Instrument (MRB 224) Photo
- Dynamic Mechanical Analyzer, DMA2980, TA Instrument (MRB 224)
- Dynamic Mechanical Analyzer, Q800, TA Instrument (MRB 224)
- Rheometer, ARES-LS2, TA Instrument
- Laser flash thermal conductivity measurement system, Netzsch LFA 457 Microflash (COE B115-116)
- Integrated IR Camera-Analyzer, IR Instruments (MRB 232)
Electrical Conductivity Measurements
- Four-probe, two-probe, and surface electrical resistivity measurement setups (four Keithley 2002 MEM multimeters and HP power supplies) (MRB 248)
- Janis Research VPF-100 cryostat system
Mechanical Property Testing
- MTS 585 test machine (25KN, hydraulic grips, laser strain gauge)
- MTS 858, table top system (COE B216)
- Micro test frame, Shimadzu AGS-J (500 N and 1 kN load cells) (MRB 127)
- Video extensometer system, Shimadzu (DVE-201 video extensometer system and TH229 pneumatic grips, Accuracy: +/- 0.01 mm) (MRB 140)
Environmental Property Testing
Modeling and Simulation
- Thermal analysis software (ABAQUS, ANSYS, MARC)
- Molecular dynamics modeling of interfacial bonding and load transfer (Materials Studio (SGI Origin 300), LAMMPS (Teragold IBM p-Series 690))
- Modeling of conductive network-electrical property relationships for polymer/carbon nanotube composites
- Simulation software for composite materials processing (RTMSim, etc.)