Change the pressure in a contained space to create a full or partial vacuum mechanically. 

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications. 

Change the pressure in a contained space to create a full or partial vacuum mechanically. 

Maintains relative humidity levels at 30% to 40%, keeping dry air circulating throughout the cabinet. 

Change the pressure in a contained space to create a full or partial vacuum mechanically. 

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications.

Change the pressure in a contained space to create a full or partial vacuum either mechanically or chemically. 

Change the pressure in a contained space to create a full or partial vacuum either mechanically or chemically. 

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications.

Perform a wide array of mechanical tests in conditions that closely replicate the temperatures that materials and components experience in their actual operating environments, providing confidence in the operating range of a material in the real world.