Thermal

Stable and reliable cooling for many common heat removal applications, including laser etching, AA furnaces, ICP, rotary evaporators, vacuum systems, reaction vessels, plasma etching, and condenser cooling.

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications.. Applications include annealing, curing, powder coating, composites curing, dehydrating, hydrogen de-embrittlement, drying, heat setting, heat shrinking, pre-heating, stress-relieving, testing, and many more.

Cool many different kinds of laser equipment that need precise cooling, including laser cutting machine, laser engraving machine, laser welding machine,  and laser cladding machine

Cool many different kinds of laser equipment that need precise cooling, including laser cutting machine, laser engraving machine, laser welding machine,  and laser cladding machine. 

Provide heat distribution and faster cure speeds across coverage areas of varying sizes.

For crushing, flattening, compressing, gluing, molding and coating materials. Can be used to test mechanical properties of a sample

For crushing, flattening, compressing, gluing, molding and coating materials. Can be used to test mechanical properties of a sample. 

For crushing, flattening, compressing, gluing, molding and coating materials. Can be used to test mechanical properties of a sample

Heat up and/or cool down samples. Typically used to coat, dry, hardening, or purification of samples. Max temperature of 2500°C. 

For the simultaneous application of high temperature and high pressure. Effective and efficient powder densification, diffusion bonding and processing of composite materials.