Thermal

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications. 

This device is used to make a stir bar, immerse in a liquid, quickly spin, or stirring or mixing a solution. At the same time, the plate can be heated to create a chemical reaction. 

Heat up a sample to create a chemical reaction. 

Quickly heat up and/or cool down samples. widely used in material & chemical researching labs to sinter all types of new material samples under vacuum and other gas conditions.

This device is used to make a stir bar, immerse in a liquid, quickly spin, or stirring or mixing a solution. At the same time, the plate can be heated to create a chemical reaction. 

Enable a flask of 250ml, 500ml or 1000ml capacity to be stirred and heated up to an element temperature of 450°C through precise electronic control, giving an accurate measure of temperature and stirring. 

Monitor, control, data log and archive various parameters. It can control temperature and stirring speed, and it can be equipped to monitor a redundant temperature and pressure. 

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications.

Provides fast heat transfer to immersed objects for immediate heating. 

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications.