Thermal

This device is used to make a stir bar, immerse in a liquid, quickly spin, or stirring or mixing a solution. At the same time, the plate can be heated to create a chemical reaction. 

Drying applications under controlled conditions at either normal atmosphere or a vacuum. Can be used to desiccate, for vacuum embedding, plating and electronic component processing applications.

Enclosed space where environmental conditions such as temperature and humidity can be controlled. Used to test materials or reactions under ideal conditions. 

Designed to give precise temperature control of the Linkam range of heating/freezing stages. 

The precise control of liquid nitrogen flow enables specific stages to be controlled at linear cooling rates as fast as 100°C/min or as slow as 0.01°C/min. 

Stable and reliable cooling for many common heat removal applications. Precise temperature control, at temperature ranges from -40° to 200°C (depending on the controller). 

Quickly ventilate heat off a system. 

Stable and reliable cooling for many common heat removal applications, including laser etching, AA furnaces, ICP, rotary evaporators, vacuum systems, reaction vessels, plasma etching, and condenser cooling. 

Complete turnkey high-speed difussion pumping thermal evaporation system. Designed to give reliable performance with simplicity of operation. Complete turnkey high-speed difussion pumping thermal evaporation system. Designed to give reliable performance with simplicity of operation. 

This device is used to make a stir bar, immerse in a liquid, quickly spin, or stirring or mixing a solution. At the same time, the plate can be heated to create a chemical reaction.